Smartpack uses its moulding compound to act
as an isolator between the copper islands and customer heatsink, and its ability to
dissipate heat from high power impulse energy is among the best possible - comparable to
more expensive solutions. Each die in the package can therefore handle the high levels of
transient impulse power associated with inductive loads. Heat passes to and spreads
through the copper island before being presented to the plastic electrical isolation
layer.
The reflected thermal impedance is
significantly better than a system using a conventional isolation layer. Smartpack's
steady state thermal performance compares very favourably with other modular solutions,
with Smartpack offering greatly improved transient thermal performance.
| Mean thermal resistance of copper islands (C/W) |
| Temperature (°C) |
40 |
60 |
80 |
100 |
| Mean (°C/W) |
0.765 |
0.678 |
0.585 |
0.485 |
|
