| Smartpack gives engineers the
flexibility they need when designing a power module without incurring high costs.
Smartpack's mean thermal performance is less than 0.5°C/W at 100°C with excellent
transient energy capabilities, allowing compact and effective design solutions.
| Package Design |
The 'start' lead frame consists of 12 heavy copper islands - all interconnected. Attached
to these islands is a nickel plated copper stamping which forms the input and output leads
to the module. A set of moulds encapsulate different numbers of copper islands to make up
different sized versions - see below.
- Copper islands provide the attachment for the power semiconductor die.
- The encapsulation material is moulded around the 12 island lead frame to give 6 pack, 4 pack or 2 pack products.
- The moulding compound is chosen for its high electrical isolation, heat transfer characteristics and mechanical stability and conforms
to the UL (V-O) flammability standards.
- The package is fully isolated.
Smartpack technology allows a thin layer of the moulding compound to provide the isolation under the
copper islands - tested for voltage isolation up to 4 kV.
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