Any type of power discrete semiconductor die can be bonded onto the copper islands. These islands measure 17.5mm by 24mm. All die mounted on an island will share a common connection - eg common collectors in the case of bipolar transistors. This feature is useful in fabricating compound semiconductor structures.

Diodes can also be included, these frequently being available in either common anode or common cathode types. Additionally, small driver transistors and diodes can be mounted on the fingers of the lead frame to give a greater degree of freedom to the circuit designer.

Internal layout of the Smartpack module		Cross-section of the Smartpack module
Click to enlarge		Click to enlarge

• Custom Power Modules
• StarMOS MOSFETs
• C3-Class Power Diodes
• Smartpack
• Matrix Convertor
• Motor Control Hybrid
• Power Supply Control ICs
• Motor Control ICs

• Design Capabilities
• Harsh Environments
• Materials
• Applications

• UK & European Research
• Test & Screening

• 100V 400A Half-Bridge
• 600V 50A Half-Bridge
• 600V 75A Half-Bridge
• 600V 100A Half-Bridge
• 600V 300A Half-Bridge
• 600V 400A Half-Bridge
• 1200V 300A Half-Bridge
• 1200V 200A Half-Bridge
• 1200V 300A GAL-GAR
• 1200V 150A Full-Bridge