Semelab’s Power Division has rapidly established a worldwide reputation for the design, development and production of state of the art custom power electronic modules. These complex modules, destined for demanding applications in aerospace, space, military and industrial fields employ the very latest packaging materials and semiconductor die. Materials such as Si₃N₄ and SiC are now becoming commonplace.

The time from product concept to production is short due to the use of advanced CAD techniques that enable thermal and mechanical stresses to be accurately modelled enabling a “right first time” design approach. From simple switching to complex multiphase topologies, both can be handled with or without incorporated control/drive circuitry and integrated cooling. Hermetic encapsulations are available, offering class leading reliability for the most demanding applications.

Semelab’s strengths lie in its wide ranging technical knowledge of semiconductor physics, packaging technology and test capability, coupled with its flexibility and speed of response to customer’s development and production needs.

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