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Custom Photo-ASICs


Semefab has over 10 years experience in the design, development and manufacture of Opto-ASICs. Potential customers can provide a black box specification and our engineers will convert this into an ASIC layout and they will manufacture, test, package and supply the completed device*.

Features:
• Optional filter coatings for specific wavelength sensitivity
• Dark current cancellation as standard
• Custom processes for Discrete photodiodes & Custom Photo-ASICs
• Clear PDIP or Black IR transmissive SOIC packages
• Probed, inked and diced 100mm wafer
• Chip on board solutions available

Custom CMOS process:
• Incorporating photodiodes in ASIC designs
• From simple photodiodes with integrated JFET to complex ASICs
• Hazard warning lighting applications, optical smoke detectors, rear view mirror dimming and many more.

Standard Opto CMOS process:
• Optimum sensitivity at 900nm
• Junction depth ~0.8 microns
• Infra-Red applications (e.g. smoke detectors)

IR Applications:
Semefab’s standard Opto-CMOS process is aimed at Infra-Red applications (e.g. smoke detectors), with the optimum sensitivity at 900nm. This is formed by a P+ anode implanted at the surface of a N- substate.




Range of Processes available for custom Photo-ASIC devices:
PPS
Start Silicon
Process Description
Photodiode
Response
401
2-3 0hm. N-type 1-0-0
Std. CMOS 3μm Gate
None
408
300-500 0hm. N-type 1-0-0
3μm Integrated Photodiode with
High Res Double Poly
IR
409
300-500 0hm. N-type 1-0-0
3μm Integrated Photodiode with
High Res Double Poly- Low Threshold
IR
410
2-3 0hm. N-type 1-0-0
3μm Integrated Photodiode with
High Res Double Poly
Visible
412
2-3 0hm. N-type 1-0-0
3μm Integrated Photodiode with
Single Poly-Low Threshold
Visible
413
2-3 0hm. N-type 1-0-0
3μm Integrated Photodiode with
High Res-Double Poly-Low Threshold
Visible

*Subject to NRE and MOQ


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