Removing discrete packages from new or existing designs and
replacing them with a chip-on-board solution is often the easiest
way to reduce cost, size and time of assembly.

Services:
• PCB population
• Clean room environment
• Solder/epoxy die-attach of CCD/CMOS arrays, photodiodes,
LEDs and Lasers - all onto a variety of substrates
• Heavy and fine-wire bond
• Encapsulation of photodiodes, LEDs and arrays (automated
and manual) including lens forming
• Plasma cleaning
• UV oven and spot-lamp cure
• Module potting (for harsh environments)
• Hermetic lid seal
• X-Ray inspection
• Optical alignment

Example of a 6 colour bare chip LED emitter/detector board with packaged CCD.

Custom low-cost Hybrid Detector. Die coated with UV bandpass filter.