| |
|
Production Up To Encapsulation Stage |
| |
|
 |
| Para 9.1 |
|
Internal (pre-cap) Visual Inspection |
| |
|
|
| Para 9.2.1 |
|
Bond Strength Test |
| |
|
|
| Para 9.2.2 |
|
Die-Shear Test |
| |
|
|
| Para 9.3 |
|
Encapsulation |
| |
|
|
| Para 9.4 |
|
High Temperature Stabalisation Bake |
| |
|
|
| Para 9.5.1 |
|
Thermal Shock |
| |
|
|
| Para 9.6 |
|
Constant Acceleration |
| |
|
|
| Para 9.7 |
|
Particle Impact Noise Detection (PIND) Test |
| |
|
|
| Para 9.8.1/2 |
|
Seal Test Fine & Gross Leak (optional) |
| |
|
|
| Para 9.9.3 |
|
Electrical Measurements at Room Temp |
| |
|
|
| Para 9.9.2 |
|
Electrical Measurements at High and Low Temp (optional) |
| |
|
|
| Para 4.4 |
|
Marking (and Serialisation for Level B) |
| |
|
|
| Para 9.10 |
|
External Visual Inspection: AQL 1% ILII |
| |
|
|
| Para 9.11 |
|
Dimension Check |
| |
|
|
| |
|
To Chart
III |
