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DSCC Screening Sequence for SMD Listed Devices (Discrete)

Semelab Hi-Rel Screening Options (585,924 bytes)
(includes all screening and inspection flows)

Method 5004: Table 1 Class level B Screening
Screen MIL-STD-883
method		 Condition Requirement
Internal Visual (2) 2010 Test Condition B 100%
Stabilisation Bake 1008 24hrs @ condition C minimum 100%
Temperature Cycling (3) 1010 Test Condition C 100%
Constant Acceleration 2001 Test condition E minimum
Y1 orientation only		 100%
Visual Inspection     100%
Initial (pre-burn-in) (8)
electrical Parameters		   In accordance with applicable
device specification		 100%
Burn-In Test 1015 160 hours at 125°C minimum 100%
Interim (Post Burn-In)
Electrical Parameters		   In accordance with applicable
device specification		 100%
Percentage Defect Allowable     5% all lots
Final Electrical Test      
a) Static tests      
25°C
subgroup 1 table 1 5005

Maximum and minimum rated operating temperature subgroup 2,3 table 1 5005

    
100%

100%
b) Dynamic or functional tests    
25°C
subgroup 4,7 table 1 5005

Minimum and Maximum  rated operating temperature subgroup 5,6,8 table 1 5005

    
100%

100%
c) Switching tests at 25°C      
subgroup 9 table 1 5005   In accordance with applicable
device specification		 100%
Seal (12)

a) Fine

b) Gross

 1014   100%
Qualification or quality (15)
conformance inspection test
sample selection		 5005 In accordance with applicable
device specification		 sample
External Visual 2009   100%

2) Test samples for group B, bond strength may be selected prior to or following internal visual, prior to sealing provided all other specification requirements are satisfied. Test method 2010 applies in full except when method 5004, alt 1 or 2 is in effect.
3) This may be replaced with thermal shock method 1111, test condition A, minimum.
8) When specified in the applicable device specification, 100% of devices shall be tested for parameters requiring deltas.
12) Fine & Gross leak tests shall be performed separately or together between constant acceleration and external visual. All device lots having any physical processing steps performed following seal shall be retested for hermeticity and visual defects.
15) Samples shall be selected for testing in accordance with the specific device class and lot requirement of method 5005.

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