Semelab is fully aware of the industries need to meet the WEEE directive for lead free processes before July 1st 2006. Due to the nature of our product being used within high reliability applications, such as military and space work, we are taking a cautious approach to this change in order to fully ascertain and appreciate the risks involved.

We are constantly monitoring the situation; as yet we are unaware of a suitable alternative to lead tin solder that meets the exacting demands of our high reliability products. Therefore, at this point in time we have no intention of changing to a lead free process.